3Layers to 18Layers
Description: ACCESS provides a unique coreless technique to realize ultra thin thickness and fine line design with excellent thermal heat dissipation by Cu pillar technology and good electrical performance due to the short electrical path between layer to layer. It allows a flexible design rule and full stacked-via technology.
CPU, GPU and Chipset for Desktop / Game Console
DTV Chip Controller, Blu-Ray Chip Controller
Networking / Portable
PA Module, Blue Tooth GPS for Wireless / Communication