澳门永利游戏平台澳门永利游戏平台

产品技术
主要产品
核心技术

Low cost Low layer count

SLCS

With Carrier

Description: Flexible design, ultra thin and low cost with excellent thermal and electrical performance coreless substrate with carrier provides customer robust structure to gain better assembly yield, the overall thickness of substrate can achieve min. 45um and suitable for BGAs, LGAs and QFNs, the product needs to have back-etched process after assembly.
Applications: recommended for High Performance CPU, GPU, ASIC Devices for Consumer/ Portable / Game Console

Without Carrier

Description: Flexible design, ultra thin and low cost with excellent thermal and electrical performance coreless substrate, assembly house can apply it directly without back-etched process. It is suitable for 1L/1.5L and min. thickness can achieve 45um.
Applications: recommended for High Performance CPU, GPU, ASIC Devices for Consumer/ Portable / Game Console

2Layers

Double Sided

Description: Conventional like 2L substrate with flexible design by ETS coreless technology with excellent thermal heat dissipation by Cu pillar technology, it is suitable for wire bonding BGA and fcCSP.
Applications: Consumer/ Portable /Networking/High Power

Ultra Thin Dielectric

Description: ACCESS can provide ultra thin 2L substrate with 25um dielectric thickness and overall thickness is 85um. It is available for fine pitch design by ETS technology to W/B BAG and fcCSP application.
Applications: Consumer/ Portable /Networking/High Power

3Layers

Ultra Thin Dielectrics 

Description: ACCESS can provide ultra thin 3L substrate with 25um dielectric thickness and overall thickness is 125um. It is available for fine pitch design to W/B BAG and fcCSP.
Applications: Consumer/ Portable /Networking/High Power